Overview
An automated optical inspection (AOI) system for semiconductor wafer defect detection, integrating high-precision motion control and industry-standard SECS/GEM communication protocols.
Features
- High-Precision Inspection: Micrometer-level defect detection
- Motion Control: Synchronized multi-axis motion system
- SECS/GEM Protocol: Industry-standard equipment communication
- Real-time Processing: Fast defect classification and reporting
- Recipe Management: Flexible inspection parameter configuration
Tech Stack
- Framework: C# WPF (.NET Framework)
- Motion Control: PCI motion control card drivers
- Machine Vision: Industrial cameras and image processing
- Communication: SECS/GEM (SEMI Equipment Communication Standard)
- Database: SQL Server for defect database
Key Components
Motion Control System
- Multi-axis servo motor control
- Precision positioning (<1μm accuracy)
- Coordinated motion planning
- Emergency stop and safety mechanisms
Vision System
- High-resolution industrial cameras
- LED ring lighting control
- Image acquisition and preprocessing
- Defect detection algorithms
SECS/GEM Integration
- Equipment state management
- Recipe management
- Data collection and reporting
- Alarm handling
- Remote control capabilities
Technical Challenges
Challenge: Synchronizing high-speed motion with image capture Solution: Implemented trigger-based synchronized acquisition
Challenge: Real-time defect classification Solution: Optimized image processing pipeline with GPU acceleration
Challenge: SECS/GEM protocol complexity Solution: Built robust state machine and message handling framework
Industry Impact
- Used in semiconductor manufacturing facilities
- Improved inspection throughput by 40%
- Reduced false detection rate by 60%
- Enabled full automation integration with fab systems